TFA300 Ultra-Thin RF PCB with 10mil Core and Immersion Gold Finish
1.Product Overview
The TFA300 is an aerospace-grade PTFE ceramic composite substrate that utilizes an innovative manufacturing process without traditional fiberglass reinforcement. With a dielectric constant of 3.0±0.04, this ultra-thin 0.3mm PCB delivers exceptional frequency stability and minimal dielectric loss, making it ideal for phased array antennas, airborne radar systems, and satellite communications.
2.Key Material Properties
Stable Dielectric Constant: 3.0±0.04 @10GHz
Ultra-Low Loss: 0.001 dissipation factor @10-20GHz
Temperature Stable: -8 ppm/°C ΔDk (-55°C to 150°C)
CTE Matched: 18/18/30 ppm/°C (X/Y/Z)
Thermal Conductivity: 0.6 W/mK
Moisture Resistance: 0.04% absorption
Flame Rated: UL 94-V0 compliant
3.PCB Construction Details
| Specification Parameter | Technical Detail |
|---|---|
| Base Material | TFA300 PTFE-Ceramic Composite |
| Layer Count | 2-Layer Rigid Construction |
| Board Dimensions | 65mm × 51mm (±0.15mm tolerance) |
| Minimum Trace Width/Space | 5/7 mils |
| Minimum Drilled Hole Size | 0.3mm |
| Via Type Support | Through-Hole Only (No Blind/Buried) |
| Overall Board Thickness | 0.3mm (10mil core + 35μm Cu) |
| Outer Layer Copper Weight | 1oz (35μm total) |
| Via Plating Thickness | 20μm |
| Surface Finish | Electroless Nickel Immersion Gold (ENIG) |
| Silkscreen Application | None (Top/Bottom) |
| Solder Mask Application | None (Top/Bottom) |
| Quality Assurance | 100% Electrical Testing |
4.PCB Stackup: 2-layer rigid PCB
Copper layer 1 - 35 μm
TFA300 Core - 0.254 mm (10mil)
Copper layer 2 - 35 μm
5.Board Statistics
Components: 12
Total Pads: 43
Thru Hole Pads: 27
Top SMT Pads: 16
Bottom SMT Pads: 0
Vias: 11
Nets: 2
6.Manufacturing & Quality Standards
Artwork Format: Gerber RS-274-X
Quality Standard: IPC-Class 2
Availability: Worldwide shipping
7.Technical Advantages
Fiberglass-Free Construction: Eliminates fiber weave effects for consistent RF performance
Multi-Dk Options: Available in 2.94, 3.0, 6.15 and 10.2 variants
Aerospace Reliability: Stable performance from -55°C to 288°C
Precision Manufacturing: Special lamination process ensures uniform dielectric properties
8.Target Applications
Aerospace equipment, space, in-cabin equipment, aircraft;
Microwaves, antennas, phase-sensitive antennas;
Early warning radars, airborne radars, etc.;
Phased array antennas, beamforming networks;
Satellite communications, navigation;
Power amplifiers.